1. Solution for customer.

Logopak offer solution adopted to customer requirements Various applicator types can be used or modified according single application type.

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2. LOGOPAK machine construction
Designed for the implementation in industrial environments. Machine chassis made of 10 mm cast and skimmed aluminium plates, all other machine parts made of stainless steel, all guides polished and hardened. Heavy-duty bearings and industrial plug connectors, Berger-Lahr stepper motors, FESTO pneumatic standard, robust welded steel support stand.

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3. LOGOPAK print engines

Unique cartridge form of printengine gives possibility to changeover in 3 minutes, no readjustment required. In line with industrial applications Logopak print engines are of a suitable construction we use NO tabletop printers sourced parts. Available in 104/160/210 mm print widths for thermal-transfer printing.

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4. LOGOPAK integrated machine intelligence LEAP II

Dual 64-bit RISC processors for high computing power, graphic configuration and data communication via RS232 or network. 1-4 MB data memory for article files, layouts and logos. An industrial CAN bus for I/O control, flexible programming and SPC high level language. A VGA touch-screen for data input, status messages and fault indication. 4 industrial V24 interfaces.

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5. LOGOPAK Service

A team of highly-qualified staff in the LOGOPAK headquarters can be reached daily for speedy telephone support. Decentralised service technicians are assigned to on-site support. There is a 24-hour hotline at your disposal (D). Networked LOGOMATIC labellers can be monitored internally and fault messages sent to Hartenholm via email or SMS with the CONTROL CENTER program installed on the customer’s premises if required. Control Center allows a centralised backup and the simultaneous import of updates to all connected labellers. The Logopak remote maintenance module (RSM) allows fast access to the labellers system data via a telephone connection.

 

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6. LOGOPAK research and development

Our own in-house R & D centres are responsible for the development of systems’ processor technology, design of the electronics, PCB development, enhanced development of firmware and the integration of new technologies such as the incorporation of RFID technologies.